Jan.
24 Course overview:
What is Flexible Electronics?
(Ober)
Jan. 31 Design: Connectors and interconnects (Wilcox, IBM;
Chan, EI)
Feb. 7 Technology Focus: Displays and lighting (OLEDs)
(Malliaras)
Feb. 14 Performance: Electrical performance and
characteristics (Rowlands, EI; Obrzut, NIST)
Feb. 21 Design: Single and multichip packages (Fillion, GE)
Feb. 28 Processing: Lithography and patterning (Ober)
March 7 Processing: Laser processing and via formation
(Egitto, EI)
March 14 Design: Substrates and barriers (Poliks, EI;
Giannelis)
March 28 Technology Focus: Solar energy conversion (Korman,
GE)
April 4 The Flexics Story - History of a Startup (Thompson)
April 11 Processing: Metal deposition (Baker; Magnuson, EI)
April 18 Performance: Physical Analysis (Matienzo, EI)
April 25 Design: Future technologies (Chan and Lin, EI)
May 2 Design: Thermal management and reliability; Course
Wrap-up (Calmidi, EI; Sammaki, BU; Ober)