ENGRI 124

Designing Materials for the Computer

Special lecture:

Lectures: Bard 140, Tuesday and Thursday, 10:10 AM

Recitation: Thurston 205, either Tuesday or Wednesday, 2:30 PM (pick one)

Catalog Data: Spring, 3 credits, 3 lectures. Introduces the materials, processes and propertiesof the semiconductors, polymers, ceramics, and metals used in the microelectroincs industry to form integrated circuits, electronic devices and displays. This coursse examines lithographic processing, metallization, diffusion, ion implantation, oxidation and other processes used in fabricatingelectronic devices and their packages. The technology of displays will be discussed including liquid crystal displays and light emitting devices.

Text Book: The Science & Engineering of Materials, D. R. Askeland, PWS-Kent

Optional Textbook: Electronic Materials: Materials in Action Series

Class Instructor: Professor C. K. Ober

Ober Group Web Site: http://www.ccmr.cornell.edu/~cober/

327 Bard Hall

Phone: 5-8417

E-mail: cober@ccmr.cornell.edu

Prerequisite by Topic: None

1.  Principles of Electronic Packaging by D. Seraphim, R. Lasky and C.-Y. Li, McGraw-Hill, New York (1989).
2. The Science and Engineering of Materials by Donald R. Askeland, PWS-Kent Pub. Co., Boston (1989).
3. Electronic materials science: for integrated circuits in Si and GaAs by James W. Mayer, S.S. Lau, Macmillan, New York (1990).
4. The Chipmakers by the editors of Time-Life Books, Time-Life Books, Alexandria, Va. (1990).
5. Engineering Materials Science by Milton Ohring, Academic, New York (1995).
6. Materials Principles and Practice, C. Newey and G. Weaver, eds., Butterworths, London, (1990).